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Integration Promotion Alliance Center
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114-117 Intellgent Chip and Design Allance
Generative AI for indoor localization in cyber-physical systems
Location information plays a critical role in many cybe..
巫芳璟
Moe Talent Cultivation Project for Advanced IC Design
Micro-ring modulator, photodetector, co-packaged optics
This course focuses on the core devices and design tech..
林銘偉
先進製程IC設計人才培育計畫_FinFET Layout模組教材
Full-Custom IC Design and Layout with FinFET Technology
This course module is primarily compiled for practical ..
黃崇禧
先進製程IC設計人才培育計畫_FinFET Layout模組教材
Full-Custom IC Implementation with ADFP Technology and Calibre Verification of Layout-Dependent Effect
To enable students to understand the TSMC N16 ADFP virt..
王鴻猷
Moe Talent Cultivation Project for Advanced IC Design
AI Chip Design and Applications — AI/ML-Enhanced IC Design Flow
This course embeds AI/ML deeply into the EDA design flo..
邱弘緯
先進製程IC設計人才培育計畫_FinFET Layout模組教材
Physical layout design of standard analog components based on the N16 FinFET ADFP technology
This module was designed to teach students in designing..
劉堂傑
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